with the development of manufacture technology, microelectronic process is going forward 隨著制造加工技術(shù)的進(jìn)步,微電子工藝不斷向前發(fā)展。
as an important step of microelectronic process, etching technology has gained much attention . it will play an important role in microfabrication such as new-made microeletronics mechanism ( mems ) and photoelectrics integration system 刻蝕工藝不僅作為微電子工藝中的關(guān)鍵技術(shù)一直受到人們的關(guān)注,而且在新興的微機(jī)電系統(tǒng),光電集成系統(tǒng)等微細(xì)加工中也將得到重要應(yīng)用。
in microelectronic process, a large amount of stress which deteriorates performance of product is led in processes of slicing, lapping, edging, epi, diffusion, oxidizing, preparation of electrode and multilevel metallization, especially, process of wafer substrate 在微電子工藝中,硅棒的拉制、切片、磨片、倒角、外延、擴(kuò)散、氧化、電極制備、多層布線及劃片等工藝中都會產(chǎn)生大量嚴(yán)重影響產(chǎn)品性能的應(yīng)力,其中尤其在襯底加工工藝中最為嚴(yán)重。
silica ( sio2 ) is a very promising material used to fabricate the optical waveguide for its low insertion loss, efficient fiber-to-chip coupling, high integration density and compatibility with microelectronic process . it is possible to realize the monolithic integration of optical devices with microelectronic devices and the passive devices with the active ones 而硅基氧化硅光波導(dǎo)以其低的插入損耗、能有效的與光纖耦合、集成密度高、可以充分利用現(xiàn)已成熟的微電子技術(shù)等特點(diǎn)成為較為理想的實(shí)現(xiàn)波導(dǎo)結(jié)構(gòu)的材料。